Spectrophotometric film thickness measurement |
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Process characteristics: |
Material |
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Film thickness |
5 .. 5000 nm |
Wafer size |
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Equipment |
Nanometrics NanoSpec 3000PHX |
Equipment characteristics: |
Batch sizes |
50 .. 150 mm: 1 |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
Wafer holder Device that holds the wafers during processing. |
aluminum plate |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |