on front Stylus profilometer 1-D step measurement |
|
| Contact force Force applied at contact point |
5 mN |
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| Depth |
0 .. 1000 µm |
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| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
step |
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| Max field size |
20 mm |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
KLA-Tencor P-15 stylus profilometer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), gallium arsenide, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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