Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  RCA clean with HF Dip (Pre-furnace clean)
  1 RCA clean
  2 HF Dip
Excluded materials gold (category), copper
Wafer size
Wafer size
Comments:
  • This is the standard pre-furnace (deposition and oxidation) clean at Case Western Reserve University.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.