|
| Line width |
1 .. 40 µm |
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| Magnifications |
2.5, 10, 20, 50, 100 |
|---|
| Materials |
silicon carbide, silicon nitride on silicon dioxide, silicon nitride on silicon, PMMA, photoresist on silicon, photoresist on silicon nitride, silicon dioxide, photoresist on silicon dioxide |
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| Wafer size |
|
|---|
| Equipment |
Leitz Ergolux Microscope |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1 |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, gallium phosphide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator |
|---|
| Comments: |
|
