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Advantages
Capabilities
Company
How to Start
About MEMS
X-ray inspection: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
X-ray inspection
Process characteristics:
Duration
Duration of x-ray inspection
Duration
*
hour
Duration of x-ray inspection, must be 1 .. 8 hour
1 .. 8 hour
Wafer size
Wafer size
10 .. 550 mm
Equipment
x-tek Revolution
Equipment characteristics:
Batch sizes
10 .. 550 mm: 1
MOS clean
no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
Attachments
Brochure.pdf
(3.1 MB, application/pdf)
attached by ozgur (Mehmet Ozgur) on 2006-02-01 14:09
tool information