Karl Suss MA6 Contact Aligner

Model
Type commercial
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
glass plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), quartz (single crystal), silicon, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 4000 µm