Heat Pulse 410 III-V Rapid Thermal Anneal |
|
|---|---|
| Model | 410 |
| Type | commercial |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 .. 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
quartz chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, gallium phosphide, indium phosphide |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 600 µm |
