Heat Pulse 410 III-V Rapid Thermal Anneal
List or range of wafer diameters the tool can accept
|50 .. 150 mm|
Types of wafers this equipment can accept
|1-flat, 2-flat, no-flat, notched|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|gallium arsenide, gallium phosphide, indium phosphide|
List or range of wafer thicknesses the tool can accept
|200 .. 600 µm|