Microwave bonder

Equipment Characteristics
Die area
Die area the equipment can accept
6.25 cm2
Die dimension
Characteristic dimension of dies (e.g., side length of square) the equipment can accept
2.5 cm
Die holder
Device that holds the die(s) during processing
quartz tube
Die materials
List of allowed materials for dies accepted by this equipment
gallium arsenide, quartz (single crystal), silicon
Die thickness
List or range of die thicknesses the tool can accept
10 .. 3000 µm