ABM Contact aligner

Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1, 25 mm: 1, 50 mm: 1, 75 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 200 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm