Automated Wire bonder |
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Alternate Name | Fine pitch wire bonding |
Manufacturer | Kluicke and Soffa |
Model | 8060 |
Type | commercial |
Comments | |
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Equipment Characteristics | |
Die dimension Characteristic dimension of dies (e.g., side length of square) the equipment can accept |
3 .. 100 mm |
Die holder Device that holds the die(s) during processing |
metal chuck |
Die materials List of allowed materials for dies accepted by this equipment |
alumina, aluminum, gallium arsenide, glass (category), Pyrex (Corning 7740), sapphire, silicon |
Die thickness List or range of die thicknesses the tool can accept |
300 .. 1000 µm |