Automated Wire bonder

Alternate Name Fine pitch wire bonding
Manufacturer Kluicke and Soffa
Model 8060
Type commercial
Comments
  • Bond pads on the substrate must not fan out excessively for fine pitch bonding.
    Design rules will be provided upon request.
Equipment Characteristics
Die dimension
Characteristic dimension of dies (e.g., side length of square) the equipment can accept
3 .. 100 mm
Die holder
Device that holds the die(s) during processing
metal chuck
Die materials
List of allowed materials for dies accepted by this equipment
alumina, aluminum, gallium arsenide, glass (category), Pyrex (Corning 7740), sapphire, silicon
Die thickness
List or range of die thicknesses the tool can accept
300 .. 1000 µm