|Batch sizes||25 .. 150 mm: 1|
Range of wafer piece dimensions the equipment can accept
|1 .. 100 mm|
Geometry of wafer pieces the equipment can accept
|other, rectangular, irregular, circular|
Range of wafer piece thickness the equipment can accept
|300 .. 1500 µm|
List or range of wafer diameters the tool can accept
|25 mm, 50 mm, 75 mm, 100 mm, 150 mm|
Types of wafers this equipment can accept
|1-flat, 2-flat, notched, no-flat|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|alumina, silicon on insulator, quartz (fused silica), indium phosphide, silicon, Pyrex (Corning 7740), gallium arsenide|
List or range of wafer thicknesses the tool can accept
|300 .. 5000 µm|