Plating cell

Type commercial
  • Requires a 10mm spot near edge of substrate fro electrical contact.
Equipment Characteristics
Piece dimension
Range of wafer piece dimensions the equipment can accept
4 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 1500 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1500 µm