Plasma Asher

Model M4L
Type commercial
  • To be used to clean DNQ based photoresist material only.
Equipment Characteristics
Batch sizes 100 mm: 12, 150 mm: 3
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm