Wafer dicing saw

Model 1100
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, glass (category), Pyrex (Corning 7740), silicon