Solvent Bench I

Model Custom
Type commercial
Comments
  • To remove the photoresist and other residues from the mask.
Equipment Characteristics
Batch sizes 100 mm: 1, 125 mm: 1, 150 mm: 1, 175 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 125 mm, 150 mm, 175 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1100 µm