Enerjet E-beam

Type commercial
  • Hemispherical dome for lift-off
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm
Wafer holder
Device that holds the wafers during processing.
rotating orbital
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), indium phosphide, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm