Philips XL40 SEM |
|
|---|---|
| Model | XL40 |
| Type | commercial |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon germanium |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |