STS DRIE

Model
Type commercial
Comments
  • Only silicon with photoresist and/or silicon dioxide is allowed.
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm