EVG 501 Bonder |
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|---|---|
| Model | 501 |
| Type | commercial |
| Comments | |
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| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Pyrex (Corning 7740) |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 3000 µm |