IMP electroless plating setup |
|
|---|---|
| Model | |
| Type | modified commercial |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 .. 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
mechanical clamp |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
