Philips XL-30 ESEM |
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Model | XL-30 |
Type | commercial |
Comments | |
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Equipment Characteristics | |
Batch sizes | 100 mm: 1, 75 mm: 1 |
MOS clean | no |
Piece dimension Range of wafer piece dimensions the equipment can accept |
5 .. 100 mm |
Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
Piece thickness Range of wafer piece thickness the equipment can accept |
0 .. 1 cm |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
Wafer holder Device that holds the wafers during processing. |
aluminum plate |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium |
Wafer thickness List or range of wafer thicknesses the tool can accept |
0 .. 1 cm |