Leitz SP |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
25 .. 150 mm |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, gallium arsenide, silicon on insulator, indium phosphide, sapphire |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
0.1 .. 10000 µm |