Leitz SP

Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 150 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, gallium arsenide, silicon on insulator, indium phosphide, sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
0.1 .. 10000 µm