Karl Suss Bond aligner |
|
|---|---|
| Model | BA-6 |
| Type | commercial |
| Comments | |
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| Equipment Characteristics | |
| MOS clean | no |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |