Karl Suss Bond aligner
List or range of wafer diameters the tool can accept
Types of wafers this equipment can accept
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|Pyrex (Corning 7740), silicon, silicon on insulator|
List or range of wafer thicknesses the tool can accept
|300 .. 600 µm|