Ultrasonic Cleaner

Model 5200
Type commercial
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 100 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Borofloat (Schott), glass (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 500 µm