Disco DAD 321 Automatic Dicer
Model DAD 321
Type commercial
Comments
  • Blade thicknesses: 25 um (only for silicon wafers up to 550 um thick), 100 um and 300 um.
  • Wafer thickness changes between 500um and 2mm for 25 um and 100um blades.
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
 1 .. 10 cm
Piece geometry
Geometry of wafer pieces the equipment can accept
 rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
 100 .. 2000 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 100 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 2000 µm