Manual Vapor Prime Spiner and Hot Plate

Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
0 .. 800 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
flat chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), quartz (fused silica), silicon, silicon carbide
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm