Manual Vapor Prime Spiner and Hot Plate
|Batch sizes||100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1|
Geometry of wafer pieces the equipment can accept
|circular, irregular, other, rectangular, triangular shard|
Range of wafer piece thickness the equipment can accept
|0 .. 800 µm|
List or range of wafer diameters the tool can accept
|50 mm, 75 mm, 100 mm, 150 mm|
Types of wafers this equipment can accept
|1-flat, 2-flat, no-flat, notched|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|Pyrex (Corning 7740), quartz (fused silica), silicon, silicon carbide|
List or range of wafer thicknesses the tool can accept
|200 .. 800 µm|