X-ray beam line

Type custom
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
500 .. 1000 µm