Innovac sputter system |
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Model | |
Type | commercial |
Comments | |
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Equipment Characteristics | |
Batch sizes | 100 mm: 1 |
Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 10 cm |
Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, irregular, circular |
Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 1000 µm |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, no-flat |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon germanium, Pyrex (Corning 7740) |
Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |