Innovac sputter system

Type commercial
  • Three targets (one rf, two dc)
Equipment Characteristics
Batch sizes 100 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 10 cm
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 1000 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon germanium, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm