Microautomation 1006 Dicing Saw |
|
|---|---|
| Model | 1006 |
| Type | commercial |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
25 .. 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
25 .. 1000 µm |
