Microautomation 1006 Dicing Saw
List or range of wafer diameters the tool can accept
|25 .. 100 mm|
Types of wafers this equipment can accept
|no-flat, 1-flat, 2-flat, notched|
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|alumina, glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator|
List or range of wafer thicknesses the tool can accept
|25 .. 1000 µm|