AG Heatpulse 210 Rapid Thermal Processing Systems |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer holder Device that holds the wafers during processing. |
quartz chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 600 µm |
