Critical point dryer

Model Autosamdri-915B
Type commercial
Comments
  • Batch size for dies (1cm2) is 5.
Equipment Characteristics
Batch sizes 100 mm: 5, 150 mm: 5, 50 mm: 5, 75 mm: 5
Die area
Die area the equipment can accept
1 cm2
Die dimension
Characteristic dimension of dies (e.g., side length of square) the equipment can accept
1 cm
Die materials
List of allowed materials for dies accepted by this equipment
silicon, silicon on insulator
Die thickness
List or range of die thicknesses the tool can accept
200 .. 600 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 600 m