Xactix, XeF2 Isotropic Si Etch

Model X2B
Type commercial
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 700 µm
[Thumbnail]xactixLwRz.jpeg (1.6 MB, image/tiff)
attached by abell (Joyce Bell-Sampson) on 2003-03-21 11:17