Xenon Difluoride Etching System

Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
0 .. 150 mm
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm