GSI ultradep
Model Ultradep
Type commercial
Comments
  • CMOS compatible metals such as Al, Ti, W, Pt, and Ta are allowed on the wafers.
  • Photoresist is prohibited.
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 75 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 electrode
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 650 µm