Hot Embosser |
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|---|---|
| Model | EV-520 |
| Type | commercial |
| Equipment Characteristics | |
| Die dimension Characteristic dimension of dies (e.g., side length of square) the equipment can accept |
1 .. 10 cm |
| Die materials List of allowed materials for dies accepted by this equipment |
silicon |
| Die thickness List or range of die thicknesses the tool can accept |
200 .. 525 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 525 µm |