Plasma Therm 790+ Nitride / Oxide PECVD |
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|---|---|
| Model | 790+ |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 9, 150 mm: 4, 200 mm: 1, 50 mm: 9, 75 mm: 9 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 .. 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer holder Device that holds the wafers during processing. |
aluminum plate |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, indium phosphide, silicon, silicon carbide |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 700 µm |
| Attachments | |
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