Plasma Therm 790+ Nitride / Oxide PECVD

Model 790+
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 9, 150 mm: 4, 200 mm: 1, 50 mm: 9, 75 mm: 9
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 .. 200 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, indium phosphide, silicon, silicon carbide
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 700 µm
[Thumbnail]sil.jpg (21.6 KB, image/jpeg)
attached by ozgur (Mehmet Ozgur) on 2004-01-21 15:01