Plasma Therm 770 Silicon DRIE (Bosch Process)

Alternate Name 770 DRIE
Manufacturer Unaxis
Model 770
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 75 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
electrostatic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 700 µm
[Thumbnail]Plasma Therm 770 P1-0351-H1-SE-ION Etch.jpg (458.9 KB, image/jpeg)
attached by abell (Joyce Bell-Sampson) on 2003-03-21 09:51