Dektak IIA

Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
25 .. 100 mm
Wafer holder
Device that holds the wafers during processing.
plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), gallium arsenide, sapphire, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm