Parylene deposition system |
|
|---|---|
| Model | PDS 2010 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 4, 50 mm: 6, 75 mm: 5 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
flat chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, alumina, glass (category), metal (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 10000 µm |