Tencor FLX 2908 Wafer Curvature (Stress) Measurement |
|
|---|---|
| Model | FLX 2908 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 125 mm, 150 mm, 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
quartz |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 600 µm |
