Tencor FLX-2320

Type commercial
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
50 mm, 75 mm, 100 mm, 125 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
aluminum ring, aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), quartz (single crystal), glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 2000 µm