Wedge Bonder
Model
Type commercial
Comments
  • Aluminum (Ultrasonic)and Gold (thermosonic)Wedge bonding on Aluminum or gold bond pads.
    Bond pads must be at least 100 um x 100 um.
    Equpment can accept large substrates (100 mm x 100mm)
Equipment Characteristics
Die dimension
Characteristic dimension of dies (e.g., side length of square) the equipment can accept
 0.1 .. 10 cm
Die holder
Device that holds the die(s) during processing
 metal chuck
Die materials
List of allowed materials for dies accepted by this equipment
 alumina, aluminum, gallium arsenide, gold, sapphire, silicon, silicon (doped), silicon (single crystal)
Die thickness
List or range of die thicknesses the tool can accept
 300 .. 1000 µm