Karl Suss MA6 Contact Aligner
|Batch sizes||100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1|
Geometry of wafer pieces the equipment can accept
List or range of wafer diameters the tool can accept
|75 mm, 100 mm, 150 mm|
Types of wafers this equipment can accept
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
|gallium arsenide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator|
List or range of wafer thicknesses the tool can accept
|200 .. 800 µm|