Karl Suss MA6 Contact Aligner

Model MA6
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, rectangular
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
[Thumbnail]KarlSuss MA6LwRz.jpg (72.0 KB, image/jpeg)
attached by ozgur (Mehmet Ozgur) on 2003-12-09 15:26