Dicing Saw |
|
|---|---|
| Model | 1006 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 50 .. 100 mm: 1 |
| MOS clean | no |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 100 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Piece thickness Range of wafer piece thickness the equipment can accept |
0.25 .. 511 mil |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, fused silica, Pyrex (Corning 7740), silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
0.25 .. 511 mil |